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Modifications:

On Detail specifications : 5513/031 (EH50151 TO EH50157), 5513/033 (EH50201 TO EH50209), 5513/034 (EH50251 TO EH50256).
Para 1.9.2 (Materials and Finishes of Naked Die Component)
(c) Glassivation
In the sentence "The glassivation material on the die backface shall be glass of thickness 5µm minimum" Suppress "on the backface"

Justification:
the backface (backside ?) of the die is metalized

Documents affected:

(5513/038) Diodes Microwave Silicon PIN U ...

(5513/032) Diodes, Microwave Silicon PIN ...

(5513/037) Diodes Microwave Silicon PIN U ...

(5512/016) Diodes Microwave Silicon Multi ...

(5513/036) Diodes Microwave Silicon PIN U ...

(5513/034) Diodes Microwave Silicon PIN F ...

(5711/002) Capacitors, Microwave, Silicon ...

(5512/023) Diodes, Microwave, Silicon, Hy ...

(5513/031) Diodes Microwave Silicon, PIN, ...

(5513/033) Diodes Microwave Silicon PIN F ...

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