|
|
|
|
|
|
|
|
|
|
|
|
|
DCR1621 Modifications:
For ESCC 9030 issue 2:
See attached Draft 3B with highlighted changes:
• Green highlights: per PSWG conclusion
• Blue highlights: minor additional editorial changes (including changes to the DCR original contents)
• Yellow highlight are the original DCR changes
PSWG change details:
Para. 3 modify the definitions of:
• Wire bonded Integrated Circuit
• Flip-Chip Integrated Circuit
……..
For ESCC 2269000 issue 2:
See attached Draft 3B with highlighted changes:
• Green highlights: per PSWG conclusion
• Blue highlights: minor additional editorial changes (including changes to the DCR original contents)
PSWG change details:
Para. 3 modify the definitions of:
• Wire bonded Integrated Circuit
• Flip-Chip Integrated Circuit
Para. 8.3.3.x: delete the sample sizes from the titles.
|
|
|
