| Document Properties | |
|---|---|
| Feedback to: | admin escies |
| Published: | 11-11-2024 |
| Public Document | |
ESA Component Activities
Introduction
ESA Component Acitivies have three major responsibilites
ESA Component and Manufacturer Qualification: To support ESA and space projects with qualified EEE parts ensuring the overall adequacy and suitability of space processes and EEE components to meet the performance requirements on schedule without additional analysis and at cost and lead time efficiency.
- The ESCC QPL ( Qualified Parts List) and ESCC QML ( Qualified Manfacturers List) contains the list of EEE components and manufacturers qualified to the requirements described by the relevant ESCC specifications.
- The ESCC PCA ( Process Capability Approval ) Certification : The ESA Process Capability Approval for technology domains supporting customised or application specific components qualification (ESCC 24300)
-
ESCC Specifications : To maintain and improve the efficiency, effectiveness and validity of (new) test methods and relevant standards. For the selections, procurement and qualification of EEE components
EEE Support for ESA Projects: Formulation of EEE requirements, parts selection, project specific EEE qualification, technical managment of NCRs and associated NRBs
EEE Component Engineering: Support to EEE fabrication process development, prototyping, reliability assessment, transfer to volume production, technical management of ESCC evaluation and qualification. Support to in-orbit demonstration.
Technical Note
Team
ESCC Qualification Team
| NAME | Main Taskes |
| Denis LACOMBE |
ESCC Executive manager deputy ESCC Lead Auditor and quality assurance manager ESCC Specifications/DCR, EUROCOMP, ESCCON, ECSS Ad-hoc WG, HPCA Component engineering training (ESCC/ECSS) CoSupport to component experts (evaluation/qualification, ESCC related questions, technical data assessment, reliability...) ESCC Auditing |
| Stephan HERNANDEZ |
ESCC Quality Assurance EPPL TA chairman ESCC Auditing Non-Conformance Control and the associated procedures and records Supervision of ESA funded evaluation Qualification Activities including Quality System Auditing |
| Giuseppe BADOLATO |
CoSupport to component experts (evaluation/qualification, ESCC related questions, technical data assessment, reliability...) Component engineering training (ESCC/ECSS) Non-Conformance Control and the associated procedures and records Qualification Activities including Quality System Auditing ESCC Quality Assurance |
| James WEISS |
Finalization of ESCC specifications, new specs and implementation of DCRs. ESCC Specification Conversion to MS word project leader. |
| Holly KRIJGSMAN |
ESCC specifications and reports Documentalist/archive ESCIES web master and editorial support ESCC Executive Secretariat Support / ESCIES & Spacecomponents.com webmaster support. QPL Monthly update / QPL database ESCC specifications system secretariat ESCC Specifications custody, configuration management system including publication of released specifications via ESCIES, DCR follow-up and implementation. |
|
Support to the ESA ESCC Executive in the technical review of all ESCC specs DCRs (~100/y) and in the drafting of generic and basic specs Follow on manufacturers’ supported products in published spec, propose retirement of obsolete specifications through DCR to REP002. Proof-read FM-to-Word files 30 specs/month (compare and amend as necessary the TE-provided Word file vs the published pdf). |
EEE Support for ESA Projects
| NAME | Supported projects (Examples) |
| Karin LUNDMARK |
Mars sample Return EnVision Rosalind Franklin Altius |
| Silvia MASSETTI |
Plato Vigil LISA Flex |
| Lionel BONORA |
Gateway Galileo Ariane6 and Vega IRIS2 |
| Florian MOLIERE |
Harmony Meteosat Third Generation Truths Argonaut |
| Lorena CAPITAN | Copernicus (CO2M, LSTM, Chime, CIMR, Cristal, Rose-L) |
| Léo FARHAT | Ariel |
| Ana COLLADO |
Metop Second Generation Forum |
EEE Component Engineering
| Name | Products and Services |
| Jouni LATTI | Micro / Millimetre, sub-millimetre wave active technologies (GaAs, GaN, SiGe) |
| Gianandrea QUADRI | Micro / Millimetre, sub-millimetre wave active technologies (GaAs, GaN, SiGe) |
| Silvia MASSETTI | SiC, Silicon based Components |
| Jürgen BEISTER |
Silicon based Components, FPGAs and ASICs, memories, Transistors, Op Amp, diodes, etc |
| Florian MOLIERE | Silicon based components |
| Michele BRONDI |
GaN power technology, Micro/nano technology |
| Léo FARHAT |
Capacitors, Supercapacitors, Resistors, Relay, Switches, Crystals, Oscillators, Connectors, Wires, Cable assemblies, Magnetics, Fuses, Thermal sensors, Heaters, Piezo element, & RF Passives : Circulators, Isolators, Power Dividers, Couplers, Loads, Attenuators, SAW Devices, etc. |
| Joaquin JIMENEZ |
Capacitors, Supercapacitors, Resistors, Relay, Switches, Crystals, Oscillators, Connectors, Wires, Cable assemblies, Magnetics, Fuses, Thermal sensors, Heaters, Piezo element, & RF Passives : Circulators, Isolators, Power Dividers, Couplers, Loads, Attenuators, SAW Devices, etc. |
| Sarah WITTIG | Photonics (Laser diodes, optical fibres, optical connectors, optocouplers, CCDs, CMOS Imaging Sensors, etc) |
| Charlotte BRINGER | Photonics (Laser diodes, optical fibres, optical connectors, optocouplers, CCDs, CMOS Imaging Sensors, etc) |
| Magdalena SZAFRANIEC | Photonics (Laser diodes, optical fibres, optical connectors, optocouplers, CCDs, CMOS Imaging Sensors, etc) |
| Houda BRAHIMI | Photonics (Laser diodes, optical fibres, optical connectors, optocouplers, CCDs CMOS Imaging Sensors, etc) |
| Ana COLLADO | Components packaging technologies, Hybrid and System in Package (SiP) assemblies, ATH (Assembly and Test house capabilities) |
| Sébastien LIBON | Components packaging technologies, Hybrid and System in Package (SiP) assemblies, ATH (Assembly and Test house capabilities) |
| Lionel BONORA | Commercial Components/COTS |
| Karin LUNDMARK | Commercial Components/COTS |
Head of Sections
| Agency | Name |
| ESA | Paavo HEISKANEN: Head of Radiation & Component Reliability Sec., Avionics & EEE Division, Electrical Department, Directorate of Tech, Eng. & Quality |
| ESA | Karin LUNDMARK : Head of Components Section, Avionics & EEE Division, Electrical Department, Directorate of Tech, Eng. & Quality |
