| Document Properties | |
|---|---|
| Feedback to: | admin escies |
| Published: | 18-11-2016 |
| Public Document | |
Hybrids and Packaging Technologies
Multi-Chip and Hybrid Modules
The design and development of new spacecraft payloads, systems, equipment and instruments, create many challenges for the Hybrid and Packaging segment of the segment of the industry.
Achieving the high performances necessary for the future requirements is the prime objective of the Hybrids, MCMs, Interconnections and Micropackaging Technologies working group.
Technologies within the domain include: Ceramic (thin and thick film), LTCC & HTCC, metal & ceramic package hybrids, optical, digital, and analogue device packaging and assembly, hermetic and the emerging non-hermetic technologies.
Activities
| Funding | Title | Objectives | Contract Number | Status | Additional Information |
|---|---|---|---|---|---|
|
T722-139QC |
Very high dissipative RF/LF package |
Development of thermally dissipative package |
4000107058/0/0/1 |
Completed |
|
|
SIUC |
Development of an optoelectronic hermetic package in glass by using glass welding technologies |
Developing Glass welding technology |
4000109821/0/0/0 |
Completed |
|
|
T523-301QT |
WP2012 - CSP and MCM-L (non hermetic): Low CTE (Coefficient of Thermal Expension) HDI substrates for flip-chip |
Flip chip on polymer boards |
4000108864/0/0/0 |
Ongoing |
|
|
ECI Ph1 EEE301 |
Re-issue: Column attach process setup and evaluation (Former EEE301) |
|
4000107948/0/0/0 |
Completed |
|
|
ECI Ph2 301 |
CCN 1 to Column attach process setup and evaluation (former EEE301) |
|
4000107948/0/0/1 |
Ongoing |
Follow-on work for alternative LGA dimensions |
|
ECI Ph4 EEE426 |
CCN1 to Development /Qualification of Flip Chip for digital advanced components (65nm)- Class Y qualification (EEE 426) |
|
4000107475/0/0/1 |
Ongoing |
Looking into technology to qualify Non-Hermetic flip chip |
|
G517-147QT |
RF Hermetic cavity pressure monitoring (G517-147QT) |
|
4000110890/0/0/0 |
Completed |
|
|
T723-410QT |
WP2014 - Investigation into applicable Inspection & Analysis Techniques for Flip Chip Devices (PTRP) |
|
4000000000/0/0/0 |
Ongoing |
|
|
5C.151 /P0/ R0 |
Packaging for highly dissipating dies on PCBs (PR1) => 2nd re-issue |
Demonstrate the capability and robustness of solderless mounting technologies |
C0000000/0/0/0 |
Ongoing |
|
|
ECI Ph3 EEE302 |
Development and Qualification of Flip Chip for digital advanced components (65nm) - EEE302 |
Devolep European flip chip packaging |
4000107475/0/0/0 |
Ongoing |
|
|
G517-091QC |
CCN 4: G517-091QC - Assessment of AAC System-in-Package (SiP) technology |
Yield improvement in production processes |
4000102607/0/0/4 |
Completed |
|
|
TRP small studies |
WP 2014: Resistance to solvents of Non-Hermetic Components encapsulation materials |
Preparation for testing of non-hermetic devices |
4000000000/0/0/0 |
Ongoing |
|
|
ECI Ph4 EEE419 |
Advanced Cooling Technologies compatible with novel Flip Chip and High Pin Count Technologies (EEE419) |
Addressing Thermal management of flip chip devices |
4000000000/0/0/0 |
Ongoing |
|
|
TRP small studies |
WP2015 - EXPRO Copper Wire Bonding BI |
Investigate the potential use of Copper wires for wire bond applications on flight hardware |
4000000000/0/0/0 |
Ongoing |
|
|
TRP small studies |
WP2015 - EXPRO+ Leak Test Methods BI |
Investigate capability and limitations of modern & novel leak test methods |
4000000000/0/0/0 |
Ongoing |
|
Additional Information
ESA Capability Approved Hybrid and MCM Manufacturers
|
Manufacturer |
Technology |
PID reference |
Certificate Validity |
Contact Point |
Plant Address |
|---|---|---|---|---|---|
|
3D Plus * |
3D Stacking Technology MCM-V * |
3300-0546 Rev 10 |
Jan 2017 |
Mr. P. Maurice |
408, rue Helene Boucher 78532 Buc |
|
Airbus DS– France |
Thick Film,Low Power, Low Frequency, Chip and Wire, |
GM.HYBR.NT.220. V.MMS |
Jan 2016 |
Mr. D. Mahasoro |
1 Boulevard Jean Moulin CS 30503 |
|
Airbus DS–France |
Smart HTCC Multi Chip |
GM.HYBR.NT.879. |
Jan 2016 |
Mr. D. Mahasoro |
1 Boulevard Jean Moulin |
|
Rhe Microsystems |
Thick Film, Low and Medium |
L7.103 |
Dec 2016 |
Mr. A. Schwarz |
Heidestrasse 70 |
|
Sagem Valence France |
Thick Film Low and Medium |
AQA 511 |
Dec 2016 |
Mr. M. Raou |
95, route de Montelier-BP234 26002 Valence |
|
TESAT Spacecom |
Thin Film Microwave Hybrids
|
63.0200.005.00PID
|
Jan 2016 |
Mr. E. Moess
|
Gerberstrasse 49 |
|
Thales Alenia Space – ETCA Charleroi Belgium |
LLKO, LLCE (Thick Film, Low Power, Low Frequency, Kovar or Ceramic Package) HPMO (High Power Molybdenum Package), MCPH (Multi Cavity, Aluminum Package) |
9100.0683 |
Dec. 2016 |
Mr B. Goffin benoit.goffin@thalesaleniaspace.com Mr. G. Taminiau |
Rue Chapelle Beaussart 101 6100 Mont sur Marchienne Belgium |
|
Thales Alenia Space - France Toulouse France |
Thin Film, Microwave Hybrid (micropackages, Macropackages, MCMC/ HTCC) |
39 731 284/924 Ed. 08, 20-05-2015 |
ESCC PCA 332/
May 2017 |
Mr. M. Lambert Marc.Lambert@thalesaleniaspace.com |
26, Av.J.F. Champollion 31037 Toulouse France |
|
Thales Alenia Space – Italy L’ Aquila Italy |
Thick Film, Low Power, Low Frequency, Chip and Wire, Kovar and Ceramic Package |
PCP-14-40-001 Rev. J 23-09-2008 |
Recertification ongoing |
Mr. U. Di Marcantonio ulisse.dimarcantonio@thalesaleniaspace.com Mr. M. Valente Massimiliano.Valente@thalesaleniaspace.com |
SS 17 Località Boschetto 67100 L’Aquila Italy |
|
Thales Alenia Space -Italy L’ Aquila Italy |
Thin Film, Low Power, Low Frequency, Chip and Wire, Kovar Package |
PCP-14-30-001 Rev. M 05/07/2010 |
Jan 2013 Renewal ongoing |
Mr. U. Di Marcantonio ulisse.dimarcantonio@thalesaleniaspace.com Mr. M. Valente Massimiliano.Valente@thalesaleniaspace.com |
SS 17 Località Boschetto 67100 L’Aquila Italy |
|
Thales Alenia Space -Italy L’ Aquila Italy |
Thin Film, and LTCC Microwave Hybrid (Kovar Package, Aluminum Package, LTCC ISP ) |
PCP-14-60-013 Issue D 12/01/2011 |
Recertification being completed@ new site |
Mr. U. Di Marcantonio ulisse.dimarcantonio@thalesaleniaspace.com Mr. M. Valente Massimiliano.Valente@thalesaleniaspace.com |
SS 17 Località Boschetto 67100 L’Aquila Italy |
List of technical Experts
| Agencies | Name | Domain | Phone | |
|---|---|---|---|---|
|
ESA |
Liam Murphy |
Hybrid |
+31 (0)7 15 65 5931 |
|
| ESA | Ana Collado | Hybrid | Ana.Collado@esa.int | +31 (0)7 15 65 3104 |
