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Feedback to:	Holly Krijgsman
Published:	27-11-2020
Public Document

EEE Testing Capabilities in Europe

EEE components play an essential role in the functional performance, quality, life cycle and costs of space systems.

The quality of the EEE components used on a spacecraft is a determining factor for their reliable operation and performance throughout the mission life. All technical systems are only as strong as their weakest link. Most space hardware is inaccessible for repair. It is therefore essential to ensure that all space components are sufficiently robust to endure the environmental and application stress they encounter.

The demand for E.E.E. (Electrical, Electronic and Electromechanical) components suitable for space applications is a growing industry within Europe.

There are various numbers of companies that offer CA, FA, and DPA testing for space components in Europe. In this page you can find a not exhaustive reference of companies and organizations able to provide Lab's expertise and services on EEE parts analysis.

ESA Components Laboratory 

ESA’s Materials & Electrical Components Laboratory guarantees an optimal choice of electrical components, materials and processes for ESA missions and external projects, considering the unique environmental  challenges involved in building for space, additionally investigating failures to ensure similar issues do not occur on future missions. This encompasses all aspects of reliability analysis, failure analysis and radiation effects characterisation. The Labs’ expertise is made available to support all ESA missions, ESA technology programs, standardization and qualification activities, and collaborative activities with the wider European space community. The Lab’s research findings have also led to an authoritative database of materials, hardware and processes qualified for space applications, as well as guiding the establishment of industrial production standards.

The laboratory’s customer focus is aimed at time critical, non-routine activities, that require independent and impartial approach, acting as a reference laboratory. The EEE component section conducts the core functions or test flow mentioned below:

·    Failure analysis (FA)
·    Destructive physical analysis (DPA)
·    Constructional Analysis (CA)
·    Miscellaneous investigation (MI)
·    Radiation Analysis (RA)

For more information about our ESA Materials and Electrical Components Laboratory Please read our Brochure

 

Tyndall

The original environmental test facilities at Tyndall were established to provide testing for the European Space Agency, and can carry out testing to rigorous space standards. In recent years, a number of additional investments have helped to enhance the facility and have broadened the range of equipment so that a comprehensive suite of services can be offered. All of the principal test chambers can be automatically controlled from a central computer and biasing / monitoring of the devices under test can be carried out. The principal test facilities include:

• Air-to-air Thermal Shock Testing
• Temperature Cycling
• Temperature / Humidity Testing
• Burn-in Testing
• High & Low Temperature Storage Tests
• Vibration Testing (Swept Sinusoidal & Random Frequency).
• Mechanical Shock Testing
• Drop / Shock Testing
• Salt Spray Testing
• High temperature / vacuum storage
• Conditioning ovens

 

Alter Technology

The Highly skilled teams of Alter Technolgoy deliver innovative solutions for  counterfeit avoidance, failure analysis, FPGA programming, component screening, radiation, test and optical component evaluation and qualification, to verify the suitability of the selected .Other inspections or tests performed by ALTER TECHNOLOGY, to evaluate the reliability, functionality and ultimately the acceptability of a component, lot, product, process or service shall be carried out in accordance with a specified procedure are listed below:

• Source inspection (pre-cap, buy-off)
  Incoming inspection
• Destructive Physical Analysis (DPA)
• Screening
• Lot acceptance testing (LAT)
• Quality Conformance Inspection (QCI)
• Relifing
• External visual inspection
• Internal visual inspection
• Scanning acoustic microscopy (SAM)
• X-ray inspection (static and dynamic)

 

Serma Group

 

SERMA GROUP is an independent, international one-stop-shop platform for solutions and services in electronics. Specialized in electronic technologies for high stress environment, the group has developed a recognized expertise and a comprehensive range of offers in its 4 core business lines:

• - Technologies and process
• - Microelectronics
• - Embedded system engineering.
• - System security

TESTING:

• Electrical Testing Engineering
• Upscreening Re-lifing
• LAT – Lot Acceptance Testing
• QOTS Qualification
• Radiation Testing
• Wafer Probing
• Assembly

 

IMT slr

Technological Laboratory activities were started by IMT in April 2008 in Valenzano (Bari province) plant c/o Tecnopolis Technological Park. IMT is equipped with a large number of Thermal chambers to perform various temperature tests, Thermal Cycles, Thermal Shocks and Humidity tests according to applicable MIL, NASA and ESA standards. Furthermore, several automatic test equipments or PC controlled are available to perform electrical tests on analogue, digital and radiofrequency components (up to 40 GHz).

Technological Laboratory activities:

• Destructive Physical Analysis    
• Construction Analysis
• Up-screening
• Relife
• Thermal Shock (air-air / liquid-liquid)
• Thermal Cycle
• High Stabilization Bake
• Humidity Test 85°C/85%RH
• Highly-Accelerated Temperature and Humidity Stress Test (HAST)
• Burn-in
• Electrical test characterization
• Hermeticity test
• Radiation test –TID – DD – SEE
• Xrays
• CSAM (Sonoscan)

 

TESAT SPACECOM

TECHNICAL EXPERTISE AND KNOW-HOW

We provide solutions to meet all your EEE component and PCB analysis and testing needs. Our state-of-the-art 200m² lab offers is certified in accordance with AN/ES 9100 in the frame of the TESAT certification and offers a wide range of testing and analysis methods to quickly and precisely determine the cause of an error or to fulfill your pre- and post-procurement analysis and testing need. The team of more than 65 experienced technologists, PCB engineers and EEE experts have honed their skills over also performing the EEE testing and failure analyses for TESAT’s own equipment manufacturing.  TESAT’s in-house ISO 17025 accredited calibration lab ensures that all of our test equipment satisfy the highest standards of accuracy, repeatability and reproducibility at all times.
After 50 years of experience in the Hi-Rel component business, we are still developing our skills and possibilities.  Over the last years, we have strengthened our expertise and capabilities in the analysis of plastic encapsulated components including acoustic microscopy (CSAM) and refined de-encapsulating techniques serving the rapidly growing application of COTS components in space missions.

There is almost no limit to our testing and analysis capabilities:

• Electrical testing on an automated SZ system  
• External visual control (EVI) according to MIL-STD-750, MIL-STD-883 or ESCC 20500.  On demand, we can offer inspection against customized inspection criteria.
• Internal visual inspection (IVI) meeting the requirements of ESCC 20400 or MIL-STD-750 and MIL-STD-883 @ up to 2500x magnification.
• SEM inspections with a resolution <10nm .
• Non-destructive imaging such as the CSAM (ESCC 25200, J-STD-020, MIL-STD-1580) or X-Ray (ESCC 20900, MIL-STD-750 Method 2076, MIL-STD-883 Method 2012)
• Fine leak testing against the toughest MIL-STD-750 and MIL-STD-883 Class K limits using both conventional and cumulative helium leak detectors.
• Gross leak testing: Penetrant dye and perfluorocarbon (“bubble”) gross leak. We also do penetrant dye testing to detect surface-breaking defects in non-porous materials.
• De-encapsulating plastic components using a chemical wet etch (jet etcher) in combination with laser ablation keeping intact even copper wires using a copper protection technology.    
• EDX material analysis or element mapping
• ESD evaluation and assessment
• TID, DDE/TNID, SEE test plan development, testing, and test review with radiation engineering consulting (ECSS-Q-ST-60-15C and ESCC-22900 / ESCC-25100 as well as MIL-STD-883 and MIL-STD-750)
• Robot-assisted automated re-soldering/re-tinning to meet your solder finish requirements or to remedy bad solderability. XRF lead finish analysis before and after (fisher scope test).
• Burn-in (and in general up-screening with/without LAT and QCI i.a.c.w. ECSS-Q-ST-60-13, MIL-STD-883 TM 5004 and 5005, MIL-PRF-38535/38534, MIL-PRF-19500, …)
• HAST and THB testing on sample or volume batches
• Classic DPA and CA
• Full failure analysis (FA) with direct manufacturer feedback loop
• Microsectioning and etching
• Thermal cycling and thermal shock, both air to air as well liquid to liquid
• Bond wire pull testing
• Terminal strength testing
• Glassivation integrity
• Constant acceleration

We would be happy to get in touch with you at partsagency@tesat.de

MASER Engineering

MASER Engineering is an independent engineering service company. Since 1993 we have offered Reliability Test and Failure Analysis Services to the semiconductor and electronic systems industry.

Whether a company is active as Fabless Semiconductor Manufacturer, IC Design House, Electronic Manufacturing Service (EMS) Provider or Original Equipment Manufacturer (OEM) MASER Engineering can support them with their daily Reliability Test or Failure Analysis challenges.

Maintaining and improving the quality level is one of our strengths. Since June 2000 we are ISO9001:2015 certified. In September 2005 we proudly became the first company in the Netherlands with an ISO/IEC 17025:2017 accreditation for reliability tests and analysis of electronic components and electronic (sub)systems.

Please find a complete overview of our services below:

Reliability Test                                                   Failure Analysis

Qualification test                                                 Non Destructive Analysis

ESD & latch-up test                                            Construction Analysis

Environmental test                                              FIB Circuit Edit

Mechanical test                                                   IPC Inspection

HALT test                                                           Advanced Failure Analysis

IP Test

Electrical test

Optical test

In case of any questions or requests please feel free to visit our website: https://www.maserengineering.eu/

 

  Rood Microtec

TRAD Tests & Radiation

QUALIFICATION, TEST AND SUPPLY OF CERTIFIED ELECTRONIC COMPONENTS

TRAD Tests & Radiations is the specialist in the testing of electronic components subjected to the effects of radiations.

Many different types of radiation effects are known to be adversely influential on the behaviour of EEE components. These effects may ultimately lead to component, and possibly to system, failure. This is why it is essential to evaluate radiation effects on electronic devices regarding their ability to withstand the radiation environment.

Thanks to its highly experienced team of PhDs, Engineers, Technicians, and to its large number of equipment (Cobalt-60 source, pulsed laser, electron accelerator, HAST, thermal cycling, testers, …) TRAD responds to many customer issues:

• Choosing the best component strategy (technology, classes, grade of T°, database of certified components, ...).
• Defining a list of components for a specific need (Newspace, L-M-HEO, large constellation of satellites, …).
• Qualifying components according to standards (MIL-STD, ESCC, ...), by screening tests, Lot Acceptance Tests (LAT), Total Ionizing Doze (TID), Displacement Damage (DD, TNID), Single Event Effects (SEE).
• Checking authenticity of components (fighting against counterfeiting).
• Supplying specific references and date codes.
• Storing qualified components on long periods.

For other European SEE & TID IRRADIATION TEST Facilities please click HERE