PCB Qualification | ESCIES (European Space Components Information Exchange System)

Document Properties
Feedback to:	Stan Heltzel
Published:	02-08-2016
Public Document

ESA Qualification Status of PCB technology


Company	Build	Laminate	PID reference	Qual. Expiration	Qual. Status	Comment	Status date	Reference

ACB	sequential rigid	Polyimide	PID_SeqRigid_v170508 ed 1	Jun-18	Qualified		May-17	ESA-TECMSP-LE-5521
	sequential rigid-flex	Polyimide	PID_FR_v161107 ed 1	Jan-18	Qualified	Renewal failed and ongoing	Jan-18	ESA-TECMSP-LE-8132

AMPHENOL-INVOTEC	sequential rigid	Polyimide	SM18T.iss.03	Nov-18	Qualified		Oct-17	ESA-TECMSP-LE-7074
	sequential rigid-flex	Polyimide	SM19T.iss.03	Aug-19	Qualified		Aug-17	ESA-TECMSP-LE-6356

CIRETEC-Elvia	sequential rigid	Polyimide	PID 2015-02 ind 01	Aug-18	Qualified		Jul-17	ESA-TECMSP-LE-6296
	sequential rigid-flex	Polyimide	PID 2015-03 ind 02	Aug-18	Qualified		Jul-17	ESA-TECMSP-LE-6296

SYSTRONIC- Cimulec	non-sequential rigid	Epoxy HTg (370HR)	PID 1 v9	Jun-18	Qualified	Renewal ongoing	May-17	ESA-TECMSP-LE-5574
	non-sequential rigid-flex	Epoxy HTg (370HR)	PID 4 v9	Aug-18	Qualified		Jul-16	ESA-TECQTM-LE-2437
	sequential rigid	Polyimide	PID 6 v9	May-19	Qualified		Apr-18	ESA-TECMSP-LE-9198
	sequential rigid-flex	Polyimide	PID 5 v9	May-19	Qualified		Apr-18	ESA-TECMSP-LE-9198
	double sided flex	Polyimide	PID 3 v8	Jul-16	Not Qualified	Discontinued	Dec-16	-
	single sided rigid	RT Duroid 5880	PID 7 v8	Jun-20	Qualified	letter to be send	Jun-18	ESA-TECMSP-LE-9964
	double sided rigid	TMM 10i	PID 7 v8	Dec-17	Not Qualified	Renewal failed and ongoing	Jan-18	ESA-TECMSP-LE-9964

TESAT Spacecom	sequential rigid, SnPb Molybdenum	Epoxy HTg	63.1500.570.21PID iss F	Apr-19	Qualified		Mar-17	ESA-TECMSP-LE-4699
	sequential rigid, ENIPIG Invar	Epoxy HTg	63.1500.570.41PID iss F	Apr-18	Not Qualified	Renewal overdue and ongoing	May-18	-

Issue date:	12/06/2018

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