| Document Properties | |
|---|---|
| Feedback to: | Stan Heltzel |
| Published: | 02-08-2016 |
| Public Document | |
ESA Qualification Status of PCB technology
|
Company |
Build | Laminate | PID reference |
Qual. Expiration |
Qual. Status |
Comment, |
Status date | Reference |
| ACB | sequential rigid | Polyimide | PID_SeqRigid_v180618 ed4 | Dec-23 | Qualified | Dec-21 | ESA-TECMSP-LE-025352 | |
| sequential rigid-flex | Polyimide | PID_FR_v190531 ed4 | Dec-23 | Qualified | Dec-21 | ESA-TECMSP-LE-025352 | ||
| AMPHENOL-INVOTEC | sequential rigid | Polyimide | SM18T.iss.04 | Jul-22 | Qualified | Qualification renewal failed and ongoing ESA-TECMSP-LE-2022-000039 | Jul-21 | ESA-TECMSP-LE-023847 |
| sequential rigid-flex | Polyimide | SM19T.iss.04 | Dec-21 | Qualified | Qualification renewal failed and ongoing ESA-TECMSP-LE-2022-000039 | Feb-22 | ESA-TECMSP-LE-2022-000426 | |
| A&P Lithos - Elvia | sculptured flex | Flex polyimide | PID v5.4 | Mar-23 | Qualified | Mar-21 | ESA-TECMSP-LE-022241 | |
| CIRETEC - Elvia | sequential rigid | Polyimide | PID 2015-02 ind 01 | - | discontinued due to fire | Jan-22 | - | |
| sequential rigid-flex | Polyimide | PID 2015-03 ind 02 | - | discontinued due to fire | Jan-22 | - | ||
| SYSTRONIC - Cimulec | non-sequential rigid | Epoxy HTg | PID 1 v11 | Sep-22 | Qualified | Oct-20 | ESA-TECMSP-LE-019334 | |
| non-sequential rigid-flex | Epoxy HTg | PID 4 v11 | Sep-22 | Qualified | Oct-20 | ESA-TECMSP-LE-019334 | ||
| sequential rigid | Polyimide | PID 6 v10 | Feb-23 | Qualified | Feb-21 | ESA-TECMSP-LE-021769 | ||
| sequential rigid-flex | Polyimide | PID 5 v10 | Oct-23 | Qualified | Sep-21 | ESA-TECMSP-LE-024692 | ||
| single sided rigid | RT Duroid 5880 | PID 7 v10 | Jun-22 | Qualified | Jun-20 | ESA-TECMSP-LE-018975 | ||
| double sided rigid | TMM 10i | PID 7 v10 | Jun-22 | Qualified | Jun-20 | ESA-TECMSP-LE-018975 | ||
| non-sequential rigid | Duroid RT6002 | PID 8 v12 | Nov-23 | Qualified | Nov-21 | ESA-TECMSP-LE-025515 | ||
| sequential rigid | Duroid RT6002 / polyimide | PID 10 v13 | Nov-23 | Qualified | Nov-21 | ESA-TECMSP-LE-025515 | ||
| TESAT Spacecom |
sequential rigid, |
Epoxy HTg | 63.1500.570.21PID iss I.1 | Jun-21 | Qualified | Renewal failed and ongoing [5.16c] | May-19 | ESA-TECMSP-LE-024058 |
|
sequential rigid, ENIPIG Invar |
Epoxy HTg | 63.1500.570.41PID iss H.1 | Feb-21 | Qualified | Renewal failed and ongoing [5.16c] | Jan-20 | ESA-TECMSP-LE-022763 | |
| sequential rigid | Polyimide | 63.1500.571.02PID iss C | Nov-23 | Qualified | Nov-21 | ESA-TECMSP-LE-025221 | ||
| Issue date: | 24/02/2022 | |||||||
