PCB Qualification | ESCIES (European Space Components Information Exchange System)

ESA Qualification Status of PCB technology

Company	Build	Laminate	PID reference	Qual. Expiration	Qual. Status per QT/2013/721/SH	Status date	Reference

ACB	sequential rigid	Polyimide	PID_SeqRigid_v170508 ed 1	Jun-18	Qualified	May-17	ESA-TECMSP-LE-5521
	sequential rigid-flex	Polyimide	PID_FR_v161107 ed 1	Jan-18	Qualification renewal failed and ongoing	Jan-18	ESA-TECMSP-LE-8132

AMPHENOL-INVOTEC	sequential rigid	Polyimide	SM18T.iss.03	Nov-18	Qualified	Oct-17	ESA-TECMSP-LE-7074
	sequential rigid-flex	Polyimide	SM19T.iss.03	Aug-19	Qualified	Aug-17	ESA-TECMSP-LE-6356

CIRETEC-Elvia	sequential rigid	Polyimide	PID 2015-02 ind 01	Aug-18	Qualified	Jul-17	ESA-TECMSP-LE-6296
	sequential rigid-flex	Polyimide	PID 2015-03 ind 02	Aug-18	Qualified	Jul-17	ESA-TECMSP-LE-6296

SYSTRONIC- Cimulec	non-sequential rigid	Epoxy HTg (370HR)	PID 1 v9	Jun-18	Qualified	May-17	ESA-TECMSP-LE-5574
	non-sequential rigid-flex	Epoxy HTg (370HR)	PID 4 v9	Aug-18	Qualified	Jul-16	ESA-TECQTM-LE-2437
	sequential rigid	Polyimide	PID 6 v9	May-19	Qualified	Apr-18	ESA-TECMSP-LE-9198
	sequential rigid-flex	Polyimide	PID 5 v9	May-19	Qualified	Apr-18	ESA-TECMSP-LE-9198
	double sided flex	Polyimide	PID 3 v8	Jul-16	Expired/discontinued	Dec-16	-
	single sided rigid	RT Duroid 5880	PID 7 v8	Dec-17	Qualification expired, renewal ongoing	Jan-18	-
	double sided rigid	TMM 10i	PID 7 v8	Dec-17	Qualification expired, renewal ongoing	Jan-18	-

TESAT Spacecom	sequential rigid, SnPb Molybdenum	Epoxy HTg	63.1500.570.21PID iss F	Apr-19	Qualified	Mar-17	ESA-TECMSP-LE-4699
	sequential rigid, ENIPIG Invar	Epoxy HTg	63.1500.570.41PID iss F	Apr-18	Qualified	Mar-17	ESA-TECMSP-LE-4699

Issue date:	16/04/2018

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