| Document Properties | |
|---|---|
| Feedback to: | Stan Heltzel |
| Published: | 02-08-2016 |
| Public Document | |
ESA Qualification Status of PCB technology
|
Company |
Build | Laminate | PID reference |
Qual. Expiration |
Qual. Status |
Comment, |
Status date | Reference |
| ACB | sequential rigid | Polyimide | PID_SeqRigid_v180618 ed 2 | Aug-19 | Qualified | Jun-18 | ESA-TECMSP-LE-010251 | |
| sequential rigid-flex | Polyimide | PID_FR_v180103 ed 3 | Aug-19 | Qualified | Jun-18 | ESA-TECMSP-LE-010251 | ||
| AMPHENOL-INVOTEC | sequential rigid | Polyimide | SM18T.iss.03 | Nov-20 | Qualified | Nov-18 | ESA-TECMSP-LE-011616 | |
| sequential rigid-flex | Polyimide | SM19T.iss.03 | Aug-19 | Qualified | Aug-17 | ESA-TECMSP-LE-6356 | ||
| CIRETEC-Elvia | sequential rigid | Polyimide | PID 2015-02 ind 01 | Mar-20 | Qualified | Feb-19 | ESA-TECMSP-LE-012785 | |
| sequential rigid-flex | Polyimide | PID 2015-03 ind 02 | Sep-20 | Qualified | Sep-18 | ESA-TECMSP-LE-012785 | ||
| SYSTRONIC- Cimulec | non-sequential rigid | Epoxy HTg (370HR) | PID 1 v10 | Sep-20 | Qualified | letter to be send | Sep-18 | ESA-TECMSP-LE-10850 |
| non-sequential rigid-flex | Epoxy HTg (370HR) | PID 4 v10 | Aug-18 | Not Qualified | NC found, renewal ongoing, [5.16b] | Sep-18 | ESA-TECMSP-LE-10850 | |
| sequential rigid | Polyimide | PID 6 v10 | May-19 | Qualified | Apr-18 | ESA-TECMSP-LE-9198 | ||
| sequential rigid-flex | Polyimide | PID 5 v10 | May-19 | Qualified | Apr-18 | ESA-TECMSP-LE-9198 | ||
| single sided rigid | RT Duroid 5880 | PID 7 v10 | Feb-20 | Qualified | Jan-19 | ESA-TECMSP-LE-012484 | ||
| double sided rigid | TMM 10i | PID 7 v10 | Feb-20 | Qualified | Jan-19 | ESA-TECMSP-LE-012484 | ||
| TESAT Spacecom |
sequential rigid, |
Epoxy HTg | 63.1500.570.21PID iss F | Apr-19 | Qualified | Mar-17 | ESA-TECMSP-LE-4699 | |
|
sequential rigid, ENIPIG Invar |
Epoxy HTg | 63.1500.570.41PID iss F | Nov-19 | Qualified | Renewal ongoing | Oct-18 | ESA-TECMSP-LE-011329 | |
| Issue date: | 15/02/2019 | |||||||
