| Document Properties | |
|---|---|
| Feedback to: | Stan Heltzel |
| Published: | 02-08-2016 |
| Public Document | |
ESA Qualification Status of PCB technology
|
Company |
Build | Laminate | PID reference |
Qual. Expiration |
Qual. Status |
Comment, |
Status date | Reference |
| ACB | sequential rigid | Polyimide | PID_SeqRigid_v221216 ed1 | Oct-24 | Qualified | qual renewal ongoing | Sep-23 | ESA-TECMSP-LE-2023-002190 |
| sequential rigid-flex | Polyimide | PID_FR_v210824 ed1 | Sep-26 | Qualified | Oct-24 | ESA-TECMSP-LE-2024-002824 | ||
| HDI rigid | Polyimide | PID_HDI_v230505 ed1b | Oct-24 | Qualified | qual renewal ongoing | Sep-23 | ESA-TECMSP-LE-2023-002530 | |
| AMPHENOL-INVOTEC | sequential rigid | Polyimide | SM18T.iss.05 | Oct-26 | Qualified | Oct-24 | ESA-TECMSP-LE-2024-002627 | |
| sequential rigid-flex | Polyimide | SM19T.iss.05 | Oct-26 | Qualified | Oct-24 | ESA-TECMSP-LE-2024-002627 | ||
|
Elvia Chateaubourg |
sculptured flex | Flex polyimide | PID v6 | Oct-26 | Qualified | Oct-24 | ESA-TECMSP-LE-2024-000483 | |
| Cistelaier | sequential rigid | Polyimide | PID_v05 | Oct-25 | Qualified | Oct-24 | ESA-TECMSP-LE-2024-002817 | |
| non-sequential rigid-flex | Polyimide | PID_v05 | Oct-25 | Qualified | Oct-24 | ESA-TECMSP-LE-2024-002817 | ||
| SYSTRONIC - Cimulec | non-sequential rigid | Epoxy HTg | PID 1 v13 | May-26 | Qualified | May-24 | ESA-TECMSP-LE-2024-001601 | |
| non-sequential rigid-flex | Epoxy HTg | PID 4 v13 | May-26 | Qualified | May-24 | ESA-TECMSP-LE-2024-001601 | ||
| sequential rigid | Polyimide | PID 6 v12 | Oct-25 | Qualified | Sep-23 | ESA-TECMSP-LE-2023-001670 | ||
| sequential rigid-flex | Polyimide | PID 5 v12 | Nov-25 | Qualified | Nov-23 | ESA-TECMSP-LE-2023-003187 | ||
| single sided rigid | RT Duroid 5880 | PID 7 v10 | Apr-27 | Qualified | Apr-25 | ESA-TECMSP-LE-2025-000935 | ||
| double sided rigid | TMM 10i | PID 7 v10 | Apr-27 | Qualified | Apr-25 | ESA-TECMSP-LE-2025-000935 | ||
| non-sequential rigid | Duroid RT6002 | PID 8 v12 | May-26 | Qualified | May-24 | ESA-TECMSP-LE-2024-000539 | ||
| sequential rigid | Duroid RT6002 / polyimide | PID 10 v13 | May-26 | Qualified | May-24 | ESA-TECMSP-LE-2024-000539 | ||
| sequential rigid | RO4835 / polyimide | PID 11 v1 | Oct-25 | Qualified | Sep-23 | ESA-TECMSP-LE-2023-002127 | ||
| TESAT Spacecom |
sequential rigid |
HTg Epoxy |
4.1 of 63.1500.571.03PID iss E | Mar-27 | Qualified | Mar-25 | ESA-TECMSP-LE-2024-001736 | |
| HDI | HTg Epoxy | 4.2 of 63.1500.571.03PID iss E | Mar-27 | Qualified | Mar-25 | ESA-TECMSP-LE-2024-001736 | ||
| sequential rigid | Polyimide | 63.1500.571.02PID iss C | Nov-23 | not qualified | delta qual ongoing | Nov-24 | - | |
| High Speed HDI | PPE Megtron 7N | 63.1500.571.04PID iss C | Mar-27 | Qualified | Mar-25 | ESA-TECMSP-LE-2024-003429 | ||
| Issue date: | 20/06/2025 | |||||||
