Published specifications

Family: Hybrids and Modules

Publication code: Multiple Component Assembly

Doc. or Spec. No.	Issue	Specification Title	Additional documents
6001	1	Generic Specification for ESCC QUALIFIED, RESIN-ENCAPSULATED MEMORY MODULE, NON-HERMETICALLY SEALED, CONSTRUCTED AS A 3D STACK OF PLASTIC PACKAGED, INDIVIDUAL ADD-ON COMPONENTS
6001/001	1	RESIN-ENCAPSULATED MICROELECTRONIC MODULE, SILICON, CMOS, 256K X 32-BIT, NON-VOLATILE MAGNETO-RESISTIVE RANDOM ACCESS MEMORY (MRAM) BASED ON TYPE 3DMR8M32VS8420 SS