TRP; T104-20QC;

Screening and Pre-evaluation of Shortwave Infrared Laser Diode for space application

This activity will select and pre-evaluate the most promising SWIR laser diodes with respect to the relevant optical, electrical, mechanical, and reliability parameters, deriving specific conclusions for the envisaged qualification program.

This contract will concern itself with a pre-evaluation exercise leading to a further qualification requirement and recomandation at a later stage. The final qualified SWIR diode is intended to be used for ACCURATE technology demonstrator.

4200021957/0/0/0

Completed

TRP; T722-148QC;

High Power Laser diode reliability study

The objective of this activity is to help optimise the qualification and screening of High Power laser Diodes (HPLDs) by studying the life time degradation mechanism in HPLDs.
In particular, two issues related to HPLDs are of particular concerns and envisaged to be the core of this activity, namely, COD (Catastrophic Optical Damage) and premature catastrophic failure in vacuum operating condition.
This activity is better led by a contractor with extensive Laser diode background and expert knowledge in semiconductor physics, in terms of research and development. Experience in planning and leading technological investigation is also a preferred quality.

4200022720/0/0/0

Completed

ECI 2

ESCC evaluation and qualification of AVIM and mini-AVIM single point optical connectors

The main objectives of this activity are that the AVIM fibre optic connectors firstly undergo a full space evaluation programme. After successful evaluation, the connector will undergo full ESCC space qualification. If the Evaluation and Qualification programs are successfull, the AVIM connector will then be listed in the EQPL

22935-09-NL-PA

Completed

GSTP

Evaluation of Optic Fibre Cable Assembly

The aim of this activity is to perform an evaluation of the assembly of several optical cables/connectors configurations that are candidate for implementation in space environment. This activity shall address both single point connector as well as multipoint connector fibre assemblies. The 12 points MTP/PC (USConnec) and MPO/APC (Furukawa) connectors tested with GORE ribbon cable FON1214-4-12. Good results, no failure discovered.
- Minimum and maximum storage temperatures are conditioned by the cable.
- Static load and torsion changes are fully reversible.
- Mating / demating sequence show fatigue after an extensive amount of cycles

T&G (Norway)

Completed

GSTP

Evaluation of Optic Fibre Cable Assembly

The aim of this activity is to perform an evaluation of the assembly of several optical cables/connectors configurations that are candidate for implementation in space environment. This activity shall address both single point connector as well as multipoint connector fibre assemblies.
Assemblies studied: Multimode: Molex LC2 +OM4 Singlemode: MTP + SMF-28e
Good results with the ribbon assembly. Assembly with single fibers attached only at the end (bundle) are more sensitive to the process. Standard fibres may show drawback with high temperature.

Fiber Pulse (Ireland)

Completed

GSTP

Adhesive sealed sensor reliability and test

The objective of this activity is to help optimise noisture level testing and to validate the 5000ppm limit dictated by MIL-STD-883. In particular, two issues related to Image Sensors are of particular concerns and envisaged to be the core of this activity. Firstly, moisture content limit determination of hermetically sealed devices which means the need to establish a more realistic and acceptable moisture level limit ( instead of the current MIL-STD 5000ppm limit). This new limit, if determined, needs to be backed up by a proper and rigorous program of investigation and tests. The objective will also include investigation of failures due to high level moisture content. The second issue is the development of a non-destructive moisture test method, to be consequently included in the CCD and CMOS image sensor generic specification ESCC 9020 [RD1]. The focus of the activity shall be to investigate moisture content of Image Sensors, including APS and CCD. However, in the early part of the activity and especially during Task-1, a general approach to optoelectronics packaging shall also be addressed

On Semi (Belgium)

Completed

On request

GSTP

 Enhanced CCD Design and Process ESCC Evaluation

This activity is part of the GSTP-4 programme. The main goal of this frame of activities is to ESCC evaluate enhanced CCD design and processes. For this purpose, different relevant Test Vehicles (TVs) of CCDs shall be defined and manufactured. The manufactured TVs shall go through an evaluation programme in conformity with ESCC standards.

Pending successful evaluation, the intention is to propose the process to be listed in the European Preferred Parts List (Part 2).

4000106794/0/0/0

On Going

GSTP

Adhesive sealed sensor reliability and test (Re-issue of ITT)

The objective of this activity is to help optimise noisture level testing and to validate the 5000ppm limit dictated by MIL-STD-883.
In particular, two issues related to Image Sensors are of particular concerns and envisaged to be the core of this activity.

4000105077/0/0/0

On Going

TRP

Development of Modified Internal Gate (MIG) Photon Detector for SDD

The main goal of this project to introduce extreemly low noise Silicon Drift Detector (SDD) macro-pixels for X-ray detection applications. The integrated sensing element (anod) of the SDD will be a low noise MIGFET (Modified Internal Gate Field Effect Transistor) which is a novel photon detector concept that we ave already successfuly developed. The MIG structures can be fabricated using standard CMOS process  with slight modifications. The operation of the MIGFET is based on a conventional MOSFET structure with a burried internal gate implimented directly underneath its conducting channel. i.e th etop gate. Due to the extreemly low input capacitance of the MIGFET amplifier and the abscence of the surface leakage current efects, we are able to produce very low noise photon detectpors for X-ray, visible, UV, near infra-red, and particle detection applications.

4000103812/0/0/0

On Going

Terminated due to insufficient fund to manufacture a prototype

TRP

Back end microlenses deposition process evaluation for CMOS image sensors

The first step of this study is to review the existing European processes dedicated to Microlenses deposition in terms of technological capabilities (pitch, available geometry), performances (dead zone/fill factor, transmission, deposition accuracy, uniformity) and achieved space qualification. Based on the selection of the most appropriate process, the second part of the study will consist in the design and manufacturing of a demonstrator which specifications will take full benefit of Microlenses deposition for performance improvements. In particular the Microlenses deposition on the prototype CIS will need to be consistent with space applications, above 5 micron. This is due to the fact that most space born image sensors pitch size is more than 5 micron.

4000109905/0/0/0

On Going

Poland .TF

alpha GaN laser diode module space assessment

Guaranteed access to leading edge GaN component technology is essential to maintain a competitive space industry in Europe. So companies and institutions are working together to build their own reliable, non-dependant, manufacturing supply chain for fabrication of space compatible GaN components and integrated circuits. The focus of this proposal, ‘alpha GaN laser diode space assessment’, is a first step in developing a reliable GaN laser suitable for space applications.

4000111601/0/0/0

On Going

First phase completed. Will end mid 2016

ECI Pha4 EEE410

Space validation of DFB Laser Module at 1.55 µm

This activity is part of the ECI programme. Its objectives are to design, develop, manufacture and space validate a DFB Laser Module at 1,55 µm using a European supplier. The intention in this activity is not to address DFB fibre lasers, and focus on Semiconductor lasers only.
The space validation exercise will be performed according to the ECSS-ST-60-05-Rev1, where the LAT ( Lot Acceptance Test) will be replaced by an Evaluation program based on the new ETP for Laser Guide line as in [RD-1]. The number of DFB Laser modules to be submitted to the Evaluation test program shall be subject to negotiation, but the Bid shall present a ETP plan with the proposal for ESA consideration.

4000110310/0/0/0

On Going

TRP

Manufacturing and Preliminary Space Assessment of a new Multi-Channel Silicon Photodiode for Optical Encoders

DataTo complete the manufacturing of multi-channel photodiodes and initiate the product validation in term of performances and reliability. The activity will include the consolidation of the photodiode manufacturing process followed by the validation testing. If the activity is successful, the pertinence of an ESCC evaluation shall be investigated.

4000109779/13/NL/CP

On Going

ECI phase4

Development and ESCC approval of a European source of 8-channel siliconphototransistors for optical encoders

To complete the manufacturing of an 8 channel phototransistor, and initiate the product approval in conformity with the ESCC standard. The activity  includes the consolidation of the phototransistor manufacturing process followed by, as a minimum an ESCC evaluation. If the activity is successful, the developed phototransistor may be proposed for introduction in EPPL. The pertinence of a complete ESCC qualification will be investigated.
Under CCN the feasability of truly hermetic packaging is investigated.

4000104712/11/NL/RA

On Going

ECI 2

Manufacturing and ESCC evaluation of an European Radiation Hard Optocoupler

This activity is part of the ECI phase 2 programme. Its objectives are to design, develop,manufacture, evaluate and qualify for space application, in accordance with ESCCrequirements, one type of optocoupler using an European supplier. The optocoupler shall be assembled with hermetic packaging, the contractor can choose TO-5 type, LCC type or both type. In the case of both package are selected, manufactured Lots shall contain the sameproportion of both package types.

On Going

Completed end of 2014. More work is needed in the next ECI phase-5

ECI 4

Space validation of Rad-Hard Erbium optical fibre amplifier at 1.55 µm < 1 W

Some recent activities on fiber optical amplifiers initiated by European and National Space Agencies highlighted the sensibility of the doped fiber to Co60 irradiation. The main work in this activity will therefore focus on the evaluation of Erbium doped fibers followed by a validation testing of optical amplifier module including the selected fibers.
The work and activities target the Space validation of Rad-Hard Erbium Optical Fibre Amplifier at 1.55 μm for low power application. The main application targeted would be optical amplification in microwave photonic repeaters or first stage amplification for high power application.

On Going

Two parallel activities

ECI 4

Space Validation of Rad-Hard co-doped Optical Fibre Amplifier at 1.55um for High Power Application (>1W)

Some recent activities on fiber optical amplifiers initiated by European and National Space Agencies highlighted the sensibility of the doped fiber to Co60 irradiation. The main work in this activity will therefore focus on the evaluation of Erbium doped fibers followed by a validation testing of optical amplifier module including the selected fibers.
The optical amplifier in the range of 10W is addressed in the current activity.

4000114166

On Going

TRP

Space validation of glass lid soldering techniques to hermitically seal small size optoelectronic parts

Discrete optoelectronic parts simply aiming at transferring a light signal require a transparent lid to achieve their function. The most straightforward way of achieving this, in terms of the materials used and their corresponding CTE, is to attach the window to the package with an adhesive. A promising alternative to using adhesive is to implement a laser welding, which is well adapted to glass interfaces and is capable of producing very high hermeticity.

On Going

ITT On Going

ECI 4

HITOS - Optical-fibre temperature sensor for structural health monitoring: engineering model space assessment

To achieve the implementation of a reliable and effective Health Monitoring system, a broad range of sensors have to be distributed along the structure to measure different flight parameters like thermal profile, pressure and friction, strain etc. The goal of the HiTOS project is to propose a substitute of conventional temperature (thermocouples) and strain (strain gauges) sensors, thanks to the new generation of Optical Fibre-based sensors arising from an evolution of conventional Fibre Bragg Gratings: the so called Regenerated Fibre Bragg Gratings or RFBG. This novel type of sensor allows the application of optical-fiber sensors till temperatures over 1000 ºC, when the limit for this sensing technology is typically between 500ºC and 600ºC.

Emxys (Spain)

On Going

ESA

Mustapha Zahir

Photonics

Mustapha.Zahir@esa.int

+31 (0)7 15 65 54 85

ESA

Karin Lundmark

Photonics

Karin.Lundmark@esa.int

+31 (0)7 15 65 53 76

ESA

Charlotte Bringer

Photonics

Charlotte.Bringer@esa.int

+31 (0)7 15 65 42 26

ESA

Sarah Wittig

Photonics

Sarah.Wittig@esa.int

+31 (0)7 15 65 49 54