9^th ESA ROUND TABLE ON MICRO AND NANO TECHNOLOGIES FOR SPACE APPLICATIONS
Swiss Tech Convention Center | Lausanne, Switzerland | 10-13 June 2014

Session 7

MEMS Design and Packaging

Reliable design of MEMS for Space Applications Using Multiphysic Simulation Tools

P. De Vincenzo¹, S. Paquay¹, O. Le Traon².

¹Open Engineering, ²ONERA.

Micro Electronic Packaging Concepts for Small System Integration and Harsh Environment

S. Schmitz¹, R. Aschenbrenner¹.

¹Fraunhofer IZM Berlin.

System-in-Package of MEMS and Electronic Components

A. T. Pereira¹, R. Oliveira¹, S. Robertson², S. Duffy², E. Zervakis³, A. Petropoulos³.

¹Lusospace,  ²Optocap, ³Theon.