Document Properties | |
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Feedback to: | Anastasia Pesce |
Published: | 16-04-2018 |
Public Document |
ESA / SCC Basic Specifications
The ESA/SCC System is OBSOLETE and is Superseded by the ESCC System .
Basic Specifications
All specification links are to pdf files with an average file size of 1 to 2 MB.
Doc. or Spec. No. | Issue | Rev. | Specification Title |
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4 | Requirements for Qualification of Standard Electronic Components for Space Application | |
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3 | A | Component Manufacturer Evaluation |
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2 | A | Internal Visual Inspection |
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3 | A | External Visual Inspection |
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2 | A | Preservation Packaging and Despatch of SCC Electronic Components |
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1 | Document Change Request Procedure | |
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3 | Radiographic Inspection of Electronic Components | |
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4 | C | Terms Definitions Abbreviations Symbols and Units |
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3 | A | Scanning Electron Microscope (SEM) Inspection of Semiconductor Dice |
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2 | Calibration System Requirements | |
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5 | General Requirements for the Marking of SCC Components | |
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2 | A | Requirements for the Evaluation of Standard Electronic Components for Space Application |
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4 | A | Requirements and Guidelines for the "Process Identification Document" (PID) |
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2 | ESA/SCC Nonconformance Control System | |
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4 | Total Dose Steady-State Irradiation Test Method | |
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2 | Requirements for the Extension of Qualification Approval of Standard Electronic Components for Space Application | |
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2 | ESA/SCC Recommendations for the Evaluation and Procurement of Non-Standard Electronic Components for Space Application | |
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1 | Microsection Examination Preparation and Evaluation of Capacitors Fixed Ceramic Leaded and Chips | |
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6 | D | Requirements for Lead Materials and Finishes for Components for Space Application |
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1 | B | Electrostatic Discharge Sensitivity Test Method |
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4 | A | Requirements for the Capability Approval of Electronic Component Technologies for Space Application |
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1 | A | Measurement of Insertion Loss for E.M.I Suppression Filters |
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3 | Minimum Quality System Requirements | |
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1 | Cross Reference of ESA/SCC US-MIL and IEC Test Methods | |
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2 | A | Resistance to Solvents of Marking Materials and Finishes |
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1 | Minimum Requirements for Controlling Environmemtal Contamination of Components | |
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1 | Single Event Effects Test Method and Guidelines | |
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1 | Application of Scanning Acoustic Microscopy to Plastic Encapsulated Devices | |
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1 | Decapsulation of Plastic Encapsulated Semiconductor Devices |