6th MNT: Session 7

Chair: Francis Pressecq, CNES & Johan Kohler, ESA

• Single-chip Generic Sensor Interface Platforms for Space Applications
• Saponara S*, Fanucci L**, Del Corona I**, Casarosa G***, Petri E****, Sarti B***
• * University of Pisa, ** Department of Information Engineering, University of Pisa, *** ESA/ESTEC/TEC-TCE, **** Microelectronic Systems Division - Consorzio Pisa Ricerche
  

• Description of MEMS 3D-System-in-Package Spacecraft Subsystems and Packaging Technology
• Thorslund R, Nilsson P, Antelius M, Davidsson J, Hagström M, Källén E, Lamoureux E, Lindegren R, Lindqvist K, Lindskog V, Ljungren A, Stenmark L, Bruhn F
• Angstrom Aerospace Corporation
  

• 3D-System-in-Package Distributed Rover Control Module featuring SpaceWire and CAN
• Bruhn F, Källén E, Lamoureux E*; Johan Kohler**
• *Angstrom Aerospace Corporation,**ESA
  

• Wafer Level High Density 3D Integration Technologies for Space Applications
• De Moor P, De Munck K, Sabuncuoglu Tezcan D, Swinnen B, Van Hoof C
• IMEC
  

• Current and Future Advanced 3D-System-in-Package Spacecraft Subsystems
• Nilsson P*, Hult T**, Baker A***, Bruhn F*
• * Angstrom Aerospace Corporation,** SAAB Space, *** SSTL