7th MNT: Session 10: MEMS packaging

• Miniaturized Interconnection Systems
• Jakob M
• AXON‘ Kabel

• Hermetic and Reliable Wafer‐Level Packaging for MEMS
• Lisec T, Reinert W
• Fraunhofer ISIT

• WALES – WAfer Level Encapsulation for Micro-Systems
• Neels A*, Niedermann P*, Muller C*, Dubois M-A*, Dommann A*, Vogel D**, Billep D**, Michel B**, Souchon F***, Gillot C***, Bloch D***, Fecht H****, Marchand L*****
• * CSEM, ** Fraunhofer ENAS, *** CEA-LETI Minatec, **** Institute of Micro and Nanomaterials - Ulm University, ***** ESA/ESTEC

• Aspects of Micropackaging and System Integration of MEMS Devices
• Pritchard A, Sturland I
• Advanced Technology Centre – Bristol

• Dual pressure chip capping technology
• Reimer K, Schröder C, Weiß M
• Fraunhofer ISIT