Document Properties | |
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Feedback to: | Manuel Galiu |
Published: | 23-08-2013 |
Public Document |
7th MNT: Session 10: MEMS packaging
- Miniaturized Interconnection Systems
- Jakob M
- AXON‘ Kabel
- Hermetic and Reliable Wafer‐Level Packaging for MEMS
- Lisec T, Reinert W
- Fraunhofer ISIT
- WALES – WAfer Level Encapsulation for Micro-Systems
- Neels A*, Niedermann P*, Muller C*, Dubois M-A*, Dommann A*, Vogel D**, Billep D**, Michel B**, Souchon F***, Gillot C***, Bloch D***, Fecht H****, Marchand L*****
- * CSEM, ** Fraunhofer ENAS, *** CEA-LETI Minatec, **** Institute of Micro and Nanomaterials - Ulm University, ***** ESA/ESTEC
- Aspects of Micropackaging and System Integration of MEMS Devices
- Pritchard A, Sturland I
- Advanced Technology Centre – Bristol
- Dual pressure chip capping technology
- Reimer K, Schröder C, Weiß M
- Fraunhofer ISIT