5th MNT: Session 8

Session 8: Assembly, Packaging and Integration

Chair: Griet van Caenegen (European Commission) and Claude Dreuon (Alenia Alcatel Space)

• 3D interconnect technology for space applications
  De Moor P.*; De Munck K.*; S. Tezcan D.*; Baert K.*; Beyne E.*; Van Hoof C.*
  * IMEC vzw
• New 3-D Technology for Ultra Low Volume Microsystem
  Val C.*
  * 3D PLUS
• A new method to assess the hermeticity of MEMS micro-packages
  Veyrié D.* ; Roux J.-L.* ; Pressecq F.* ; Tetelin A.** ; Pellet C.**
  * CNES, ** IXL
• From MEMS to MEMS based systems
  Pouteau V.* ; Bertsch N.
  * MEMSCAP
• Microcells for Metastructures - System analysis of long-term application of MST to large Space Structures
  Lecuyot A.*; Hobbs S.E.**; Honstvet I.A.***
  * Surrey Satellite Technology Ltd., ** Cranfield University, *** EADS Astrium Ltd.