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Feedback to: | Laurent Marchand |
Published: | 08-01-2006 |
Public Document |
5th MNT: Session 8
Session 8: Assembly, Packaging and Integration
Chair: Griet van Caenegen (European Commission) and Claude Dreuon (Alenia Alcatel Space)
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3D interconnect technology for space applications
De Moor P.*; De Munck K.*; S. Tezcan D.*; Baert K.*; Beyne E.*; Van Hoof C.*
* IMEC vzw -
New 3-D Technology for Ultra Low Volume Microsystem
Val C.*
* 3D PLUS -
A new method to assess the hermeticity of MEMS micro-packages
VeyriƩ D.* ; Roux J.-L.* ; Pressecq F.* ; Tetelin A.** ; Pellet C.**
* CNES, ** IXL -
From MEMS to MEMS based systems
Pouteau V.* ; Bertsch N.
* MEMSCAP -
Microcells for Metastructures - System analysis of long-term application of MST to large Space Structures
Lecuyot A.*; Hobbs S.E.**; Honstvet I.A.***
* Surrey Satellite Technology Ltd., ** Cranfield University, *** EADS Astrium Ltd.