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Chair: Francis Pressecq (CNES) - Nicolas Saillen (ESA) |
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Failure Avoidance during Component Development by Advanced Simulation together with Experiment based Reliability Assessment |
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Vogel, D.; Auersperg, J.; Sommer, J.-P.; Rzepka, S.; Michel, B. |
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Fraunhofer ENAS, GERMANY |
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MEMS Switches: Status on reliability Issues and Characterization Techniques |
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Dhennin, J.1; Seguineau, C.1; Broué, A.1; Coccetti, F.1; Courtade, F.2 |
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1NOVA MEMS, FRANCE; 2CNES, FRANCE |
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The HTA Reliability Platform |
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Neels, A.1; Michel, B.2; Bloch, D.3; Lahti, M.4; Karppinen, M.4; Dommann, A.1; Vogel, D.2 |
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1CSEM, SWITZERLAND; 2Fraunhofer ENAS, GERMANY; 3CEA-LETI Minatec, FRANCE; 4VTT, FINLAND |
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Isolation of Degradation Mechanisms in Capacitive Microelectromechanical Switches |
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Olszewski, O. Z.; Houlihan, R.; O'Mahony, C.; Ryan, C.; Duane, R. |
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Tyndall National Institute, University College Cork, IRELAND |
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Mechanical Damage Monitoring on Aluminum Freestanding Thin Films used for MEMS Applications |
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Seguineau, C.1; Fourcade, T.1; Broué, A.1; Desmarres, J.-M.2; Dalverny, O.3 |
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1NOVA MEMS, FRANCE; 2CNES, DCT/AQ/LE, FRANCE; 3Université de Toulouse, INPT, LGP-ENIT, FRANCE |
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Challenges ahead of a MEMS Qualification Standard Methodology |
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Rodrigues, B. |
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Lusospace, PORTUGAL |
