| Doc. or Spec. No. |
Issue |
Specification Title |
Additional documents |
 2029000 |
1 |
Checklist for Monolithic Microcircuit Manufacturer and Line Survey |
|
| 2099000 |
1 |
Radiographic Inspection of Integrated Circuits |
|
| 2139000 |
1 |
Terms Definitions Abbreviations Symbols and Units for Integrated Circuits |
|
| 2269000 |
7 |
Evaluation Test Programme For Integrated Circuits: Monolithic And Multichip Microcircuits, Wire-Bonded, Hermetically Sealed And Flip-Chip Monolithic Microcircuits,Solder Ball Bonded, Hermetically And Non-Hermetically Sealed |
|
| 2269000 |
6 |
Evaluation Test Programme For Integrated Circuits: Monolithic And Multichip Microcircuits, Wire-Bonded, Hermetically Sealed And Flip-Chip Monolithic Microcircuits,Solder Ball Bonded, Hermetically And Non-Hermetically Sealed |
|
| 2269000 |
5 |
Evaluation Test Programme For Integrated Circuits: Monolithic And Multichip Microcircuits, Wire-Bonded, Hermetically Sealed And Flip-Chip Monolithic Microcircuits,Solder Ball Bonded, Hermetically And Non-Hermetically Sealed |
|
| 2269000 |
4 |
Evaluation Test Programme for Monolithic Integrated Circuits |
|
| 2269000 |
3 |
Evaluation Test Programme for Monolithic Integrated Circuits |
|
| 2269000 |
2 |
Evaluation Test Programme for Monolithic Integrated Circuits |
|
| 2269000 |
1 |
Evaluation Test Programme for Monolithic Integrated Circuits |
|
| 2439000 |
1 |
Requirements for Capability Approval of Monolithic Microcircuit Technologies |
|
| 2549000 |
1 |
Requirement for the Technology Flow Qualification of Monolithic Microcircuits |
|
| 9000 |
11 |
Integrated Circuits: Monolithic And Multichip Microcircuits,Wire-Bonded, Hermetically Sealed And Flip-Chip Monolithic Microcircuits, Solder Ball Bonded, Hermetically And Non-Hermetically Sealed |
|
| 9000 |
10 |
Integrated Circuits: Monolithic And Multichip Microcircuits,Wire-Bonded, Hermetically Sealed And Flip-Chip Monolithic Microcircuits, Solder Ball Bonded, Hermetically And Non-Hermetically Sealed |
|
| 9000 |
9 |
Integrated Circuits: Monolithic And Multichip Microcircuits,Wire-Bonded, Hermetically Sealed And Flip-Chip Monolithic Microcircuits, Solder Ball Bonded, Hermetically And Non-Hermetically Sealed |
|
| 9000 |
8 |
Integrated Circuits: Monolithic And Multichip Microcircuits,Wire-Bonded, Hermetically Sealed And Flip-Chip Monolithic Microcircuits, Solder Ball Bonded, Hermetically And Non-Hermetically Sealed |
|
| 9000 |
7 |
Generic Specification for Integrated Circuits (Monolithic and Multichip Microcircuits), Hermetically Sealed |
|
| 9000 |
6 |
Generic Specification for Integrated Circuits Monolithic |
|
| 9000 |
5 |
Generic Specification for Integrated Circuits Monolithic |
|
| 9000 |
4 |
Generic Specification for Integrated Circuits Monolithic |
|
| 9000 |
3 |
Generic Specification for Integrated Circuits Monolithic |
|
| 9000 |
2 |
Generic Specification for Integrated Circuits Monolithic |
|
| 9000 |
1 |
Generic Specification for Integrated Circuits Monolithic |
|
