| Document Properties | |
|---|---|
| Feedback to: | Fernando Martinez |
| Published: | 23-05-2011 |
| Public Document | |
ESCCON 2011 - 16th of March 2011
The presentations can be downloaded individually or as a group of morning and afternoon sessions.
| 09:00 – 09:25 | The business roadmap. Trends for the future |
| F. Caizzone , IMS-Group Vice President, Business Management and Operation General Manager, STMicroelectronics | |
| 09:25 – 09:50 | Roadmaps for III-V in Europe |
| U. Meiners, Chief Technology Officer, UMS | |
| 09:50 – 10:15 | The business roadmap. Trends for the future |
| P. Sauvage, General Manager, Atmel Aerospace | |
| 10:15 – 10:40 | (Digital) Packaging for the future. Supply chain of packaging solutions (1). |
| (Digital) Packaging for the future. Supply chain of packaging solutions (2). | |
| J. Vernet, ATMEL, and T. Gouvernel, e2v | |
| 10:40 – 11:00 | The business roadmap, a Design House perspective |
| P. Danielson, Executive VP and Managing Director, Aeroflex Gaisler AB | |
| 11:15 – 11:45 | The European Components Initiative (1) |
| The European Components Initiative (2) | |
| The European Components Initiative (3) | |
| M. Labrunee and J-L. Venturin, CNES; A. Jain, DLR; M. Nikulainen, L. Marchand, ESA | |
| 11:45 – 12:15 | The experience in expanding operations in Europe and the business roadmap |
| R. E. Reddy, CTO, and P. Le Bohec, Managing Director Europe, PEREGRINE | |
| 12:15 – 12:45 | Lessons learnt from ECI vs business roadmap |
| J-M. Bureau, Project Manager, Cobham Microwave | |
| 14:00 – 14:20 | The business roadmap. Trends for the future |
| T. Gouvernel, Head of Strategic Business Development, e2v | |
| 14:20 – 14:40 | In-orbit anomalies due to radiation. Lessons learnt |
| R. Ecoffet, Senior Expert Radiation, CNES | |
| 14:40 – 15:00 | EEE Parts Procurement for constellations |
| O. Rémondière, Director of Operations Quality Assurance, Thales Alenia Space | |
| 15:00 – 15:20 | The experience of commercial components insertion in GAIA |
| P. Peres, ASTRIUM Toulouse; A. Gómez, CRISA | |
| 15:20 – 15:45 | The coordinated procurement of EEE components for ATV |
| M. Veith, Project Manager, TESAT-Spacecom | |
| 16:15 – 16:40 | ESCC Evaluation and Qualification Programmes |
| J. Howley, Enterprise Ireland; G. Joormann, DLR; J. Wong, ESA | |
| 16:40 – 17:00 | Optoelectronics: risk management of problems encountered |
| A. Bensoussan, Senior Components Expert, Thales Alenia Space Toulouse | |
| 17:00 – 17:40 | Challenge for advanced payloads: Next generation ASICs, FPGAs and Advanced Conversion components needs (1) |
| Challenge for advanced payloads: Next generation ASICs, FPGAs and Advanced Conversion components developments (2) | |
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(1) L. Baguena, Thales Alenia Space, M. Childerhouse, Astrium; (2) F. Malou and D. Dangla, CNES; L. Hili and D. Merodio, ESA |
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