ESCIES: SMT Verification

SMT Verification Information:

ESA-TECQTM-MO-1143 Identified critical devices for the assembly as per ECSS-Q-ST-70-38 on PCB laminates
ESA-TECQTM-MO-1143 Issue 1 Identified critical devices for the assembly as per ECSS-Q-ST-70-38 on PCB laminates
ESA-TECQTM-MO-1143 Issue 2 Identified critical devices for the assembly as per ECSS-Q-ST-70-38 on PCB laminates
ESA-TECQTM-MO-1931 - Assembly approval status review during MPCB
ESA-TECQTM-MO-1931 Issue 3 Signed -Guideline for the review of Approval status of electronics assembly configurations during MPCB
TEC-QT-2012-335-CV Verification to ECSS-Q-ST-70-38C
TEC-QT-2013-398-CV SMT Verification as per ECSS-Q-ST-70-38C, revised work procedure
TEC-QT-2015-460-CV Replacement of Mapsil 213 by Mapsil 213B for PCB conformal coating application
ESA-TECMSP-MO-006249 -Solderless assembly verification
ESA-TECMSP-RS-014795 - High Reliability assembly for surface mount and though hole connections

ESA-TECQTM-MO-1149 - Signed - Verification to ECSS-Q-ST-70-38C. Status of Surface Mount Technology (STM) as of Oct 2015
ESA-TECQTM-MO1892 - Use of Non-ESA qualified PCB finish for assembly of ESA programmes
ECSS-Q-ST-70-38 Rev1 - Published - High-reliability soldering for surface-mount and mixed technology

ESA-TECMSP-MO-013161-signed - Procedure for approval of laboratories for microsectioning of electronic assemblies for ESA programmes
ESA-TECMSP-MO-013162-signed - Requirements for outsourcing laboratories performing microsectioning of electronic assemblies

ESA-STR-258 Issue 2 -ESA-Approved Skills Certification Requirements Electronic Assembly Domain