ESCIES: Printed Circuit Boards

ESA Approved Manufacturers and Qualification Status of PCBs

• ESA Qualification Status of PCB technology
• ESA Approved PCB Manufacturers - contact details

ECSS standards

• ECSS-Q-ST-70-10C  Qualification of printed circuit boards (superseded by 70-60)
• ECSS-Q-ST-70-11C  Procurement of printed circuit boards (superseded by 70-60)
• ECSS-Q-ST-70-12C  Design of printed circuit board (active)
• ECSS-Q-ST-70-60C  Qualification and procurement of printed circuit boards (active)

• Gerber data for THB test vehicle as per clause 9.7.2 from ECSS-Q-ST-70-60
• Gerber data for CAF test vehicle as per clause 9.7.3 from ECSS-Q-ST-70-60

Active ESA memos and checklists

• QT/2014/361/SH                 ECSS standards for PCB design
• ESA-TECMSP-MO-7424     Project qualification of Thermount 85NT PCBs
• ESA-TECMSP-MO-11532   ECSS standards for PCB qualification and procurement
• ESA-TECMSP-MX-11559   Checklist to ECSS-Q-ST-70-60 for PCB manufacturers
• ESA-TECMSP-MX-11320   Checklist for ENIG ENEPIG ENIPIG finish
• ESA-TECMSP-MX-12940   Checklist for review of PCB technology in MPCBs
• ESA-TECMSP-MX-14192   Input to checklist for MRR
• ESA-TECMSP-MX-16451   Compliance matrix ECSS vs IPC6012DS
• ESA-TECMSP-TN-19672   Microvia process guidelines
• ESA-TECMSP-HO-2023-003430  ESA's PCB training course
• ESA-TECMSP-HO-2023-003531  ESA's electronic assembly training course

Historic ESA memos

• QT/2010/018                       Procedure for ESA qualification of PCB manufacturers (superseded by 70-60 ch 5.4-5.12)
• QT/2013/378/SH                 Proposal for new class of cleaner base materials, Appendix A to IPC-4101 (superseded by 70-60 annex I)
• QT/2013/681/SH                 High resistance electrical test for PCBs (superseded by 70-60 ch 9.3.7)
• QT/2013/721/SH                 Reinforcement of ECSS-Q-ST-70-10 for qualification renewal (superseded by 70-60 ch 5.15-5.16)
• QT/2013/725/SH                 Traceability of PCB procurement (superseded by 70-60 rqt 6.2.2.a, 6.2.6.c.7+8)
• QT/2013/730/SH                 Cleanliness control for PCB manufacturers (superseded by 70-60 ch 6.7)
• QT/2014/148/SH                 RFA justified by project qualification using group 6 (superseded by 70-60 ch 7.7)
• QT/2014/172/SH                 Quarterly QA reports from PCB manufacturers (superseded by 70-60 ch 5.13-5.14)
• QT/2014/304/SH                 Letter to IPC, Cleanliness of base materials (obsolete)
• QT/2014/030/SH                 IST procedure for PCB coupons (superseded by 70-60 ch 9.5.5)
• QT/2014/317/SH                 Alternative sources for Printca PCBs (superseded by qual status and ESA-TECMSP-MO-7424)
• ESA-TECQTM-MO-1239    Approach for pad lift and associated laminate cracks (superseded by 70-60 table 10-25, ch 10.6.2)

Technology development & conference papers

• GSTP Advanced manufacturing compedia 2015 (G61A-016QT; G61A-017QT) and 2019 (GT1A-313MS; GT1A-316MS)
• PCB/SMT WG web space on spacecomponents.org (login required)
• EMPS Electronic Materials, Processes for Space, workshop proceedings
• IPC APEX 2013 Insulation Resistance of Dielectric Material under Environmental Testing
• IPC APEX 2015 Short Circuit caused by Contamination in PCB
• CEAS Space Journal  Advanced PCB technologies for space and their assessment using up‑to‑date standards, 2021