Hybrids, Multi Chip Modules, 3D Stacking and Packaging Technologies

ESCIES: Hybrids Presentations

1 presentation April 28 2004

• 3D-Plus memory products
• 3D-Plus presentation
• 3D-Plus DC/DC converters
• Microcool Project - Micro Heatpipes
• Miniaturized Fluid Loops
• NMRC Adhesives Study

2 presentation April 27 2005

• Agenda
• Evaluation of adhesives for flip-chip assembly
• Investigation of flip-chip assembly technologies
• Flip-chip for microwave applications
• State of the art in high-TCE ceramic packages
• Status of LTCC technology use for substrates and packages
• Status of BGA packages mounting on PCB
• Participant list

3 presentation May 3 2006

• Agenda
• AAS ETCA Power Hybrid Technologies - DC-DC Converters
• Atmel MCGA MCM Packages
• Development of RF switches MEMs using LTCC Technology
• Evaluation of a HDI Demostartor Module with CSP and BGA packages
• MCM Smart HTCC technology Application to Astrium Space Digital Products
• Microwave organic PCBs for Space Applications

4 Presentations May 22 2007

• Agenda
• Glob-Top of RF Chips Investigations
• Evaluation of Soft Soldering on Alluminium Nitride
• PCMC Package for High Power Applications
• Influence of PCB Plating on Reliability of CIN-APSE
• RF MEMS Switches Realized using LTCC Technology
• 3D MoP 3 Dimensional Microwave Packaging
• Testing of the Assembly of 625 MCGA Packages on PCB
• Dye Penetrant Test for BGA Assemblies