| Document Properties | |
|---|---|
| Feedback to: | Holly Krijgsman |
| Published: | 09-05-2019 |
| Public Document | |
Monday 11-March-2019
Session 1 High-performance components
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Introduction and opening of the Conference B. Schade |
ESA |
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Keynote presentation: Passive parts for Space applications(on-line version) D. Lacombe |
ESA |
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NASA and the NEPP programme: new technology and plans J. Pellish |
NASA GSFC / USA |
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Perspective on high density technology amd supply chain for rad-hard ASIC and ASSP F. Martin |
STMicroelectronics / France |
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High-density Packages in Space: state of the art, ongoing developments and roadmap J-P. Peltier |
Teledyne e2v / France |
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A. Wagner |
Airbus Defence and Space / France |
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K. O' Neil |
Microchip / USA |
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J. Le Mauff |
Nanoxplore / France |
Tuesday 12-March-2019
Session 2 EEE Components for New Space
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COTS in long-term HiRel applications J. Loman |
SSL / USA |
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Innovative procurement approaches D. Núñez |
Alter Technology Group / Spain |
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COTS for Space: Market analysis J. Haala |
Tesat Spacecom / Germany |
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Commercial passive parts for Space T. Torloting |
CNES / France |
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Rad-Hard Plastic components for Constellations T. Brunet |
STMicroelectronics / France |
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A. Mouton |
Airbus Defence and Space / France |
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Highly Reliable COTS Satellite and Launcher Computers A. Billström |
RUAG Space / Sweden |
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E. Marin-Schmidt and N. Jaussein |
Thales Alenia Space / France |
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COTS to Rad Tolerant and Rad Hard solutions Space applications N. Ganry |
Microchip / France |
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Parts Quality Assurance Nanosat ANGELS A. Dufour |
CNES / France |
Session 3 High-performance Components |
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Keynote presentation: New Products and Technologies P. Maurice |
3D+ / France |
| J. Andersson | Cobham Gaisler / Sweden |
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ARM new European processor development (DALHIA) J-L. Poupat |
Airbus Defence and Space / France |
Selected manufacturer and component suppliers presentations |
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| Arquimea | Adrien Frouin |
| Infineon | Wolfgang Keubler |
| Intersil | Oscar Mansilla |
| IMEC | Nico Beylemans |
| Globalfoundries | Ghassn Zamat |
| AEMtec | Dan Negrea |
| IMST | Reimund Wittmann |
| Teledyne e2v | Eric Marcelot |
| Space IC | Volodymyr Burkhey |
| Cicor-Rhe | Andreas Schwarz |
| SGS Institut Fresenius | Olaf Guennewig |
| Isabellenhuette | Daniel Theis |
| Comtronic | Adrian Bernd |
| ACST | Matthias Hoefle |
| Gore | Ron Leary |
| Reflex Photonics | Guillaume Blanchette |
| Cobham RAD | Richard Sharp |
| Tyndall | Finbar Waldron , Peter Smyth |
Wednesday 13-March-2019
Session 4 Industry 4.0; Implications for Hi-rel components
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What is changing in hardness assurance? The challenge of technology Evolution R. Ecoffet |
CNES / France |
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Additive manufacturing method for Microminitaure Coax-cables and twinax-cables and the corresponding connectors B. Rosenberger |
Rosenberger / Germany |
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Usage of COTS EEE Components in ESA Space Programs M. Nikulainen |
ESA |
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Supply chain on parts for Industry 4.0 A. Koeder |
Airbus Defence and Space / Germany |
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doEEEt.com: HiRel EEE Parts Catalog J.C. Muñoz |
Alter Technology Group / Spain |
| Coffee break | |
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Transition to a new era of Space Equipment manufacturing M. Jonek |
Tesat Spacecom / Germany |
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Remote testing, new approach for Space M. Domínguez |
Alter Technology Group / Spain |
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S. Bourbouse |
Airbus Defence and Space / France |
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REACH update and its impact on availability of components for Space in Europe P. Heiskanen |
ESA |
Session 5 ESCC and Agencies Reports |
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Class Y status and update on JEDEC JC13 related tasks S. Agarwal |
NASA/JPL-Caltech / USA |
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JAXA update on EEE components development and qualification A. Maru |
JAXA / Japan |
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New EEE components R&D in China for Aerospace applications W. Wang |
CACEC - CAST / PRC |
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CNES update on EEE components development and qualification M. Labrunee & F. Nouals |
CNES / France |
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DLR update on EEE components development and qualification B. Gökgöz |
DLR / Germany |
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A. Pesce |
ESA |
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The ESCC Components Technology Board Roadmap J-L. Cazaux |
Thales Alenia Space / France |
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ESCC Policy and Standards Working Group report F. Vacher |
CNES / France |
