| Document Properties | |
|---|---|
| Feedback to: | Holly Krijgsman |
| Published: | 31-03-2023 |
| Public Document | |
DAY 1
Tuesday 07-March-2023
ESCC and Agencies
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Introduction and Opening of the Conference B. Schade, ESA |
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Olivier Perat, ESA |
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JAXA Kawara Hiroaki, JAXA |
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F. Malou, CNES |
PHOTONICS |
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State of the art and future needs Anna Eiden, ESA |
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High speed serial links : Architecture and Optical transceiver selection and outlook on future needs Linda Cyrille, TAS |
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Different photonic part approach strategies, from specific project to product range Vincent Carreau, ADS |
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Space photonics research projects: Siphodias and optical transceiver characterization Aintzane Lujambio Genua, ALTER Sp. |
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Multi-Fiber Interconnect Solutions for payload data processing Yann Le Luyer, Radiall |
Lunch Break
PHOTONICS Continued
Break
ESCC and Agency Reports
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Premysl Janik, ESA |
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European Commission Presentation Fabio Vitobello, EC |
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CTB: Component Technology Board & its EEE Roadmap Jean-Louis Cazaux, TAS |
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Anastasia Pesce, ESA |
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Shri Agarwal, NASA |
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DAY 3Thursday 09-March-2023Lead Free issue and PCB |
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On-orbit Validation to Mitigate Tin Whisker Growth Ichimaru Shinichiro, JAXA |
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Carole Villette, ESA |
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Gianni Corocher, ESA |
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Stan Heltzel, ESA |
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BreakLessons Learned |
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Back to the Moon – Artemis ESM EEE Insights Frederik Kuechen, TESAT |
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New Development and New Component |
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Market view, market crisis and mitigation Martin Veith, ADS |
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AR-Electronique solutions for space Emmanuel Girardet, AR-Electronique |
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FPGAs and Hardware-Based Security – Component up to System Level Aspects Alberto Moreno, TESAT |
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GR765 & GR7xV rad-hard RISC-V multi-core processor Francisco Hernandez, Frontgrade Gaisler |
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BreakNew Development and New Component Continued |
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Scalable solutions to face new space challenges in Europe Nicolas Ganry, Microchip |
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J-L Frigoul, NanoXplore |
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The European rad-hard SoC+ FPGA suitable for future space applications Jean-Luc Poupat, ADS & Grégory Grimonet, TAS |
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Ka-band data converter : new development and first measurements François Boré, Teledyne/E2V |
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BreakNew Development and New Component Continued |
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Gbit RadHard NVM with serial interface - Mnemosyne Jeanne Tongbong, 3D Plus |
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ESCC and Agency Reports |
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Thilo Kaupisch, DLR |
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EDA CapTech Space – technologies in the Strategic Research Agenda Erik Korsbakken, EDA |
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The ESCC Policy and Standar Working Group (PSWG) Presentation Thomas Torloting, CNES |
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B. Schade, ESA |
