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Feedback to:	Holly Krijgsman
Published:	29-07-2014
Public Document

EMPPS Workshop

**Tuesday 20 May 2014**
Presentor	Organisation	Title
Mikko Nikulainen	ESA	Welcome and Introduction

Session 1: PCB Standards and Roadmaps


Presentor	Organisation	Title
M. Brandon, D. Manteigas, W. Scheidler	MBDA EDA	PCB Roadmap & Recommendations towards a European non-dependent & Sustainable PCB Supply Chain Publication
B. Birch, J. Furlong	PWB Interconnect Solutions Inc.	Plated Through Reliability and Material Integrity Results for 24 Materials Processed Through Lead Free Assembly Publication
L. Wallin	IPC Europe	Increased Reliability and Quality with the Assistance by IPC Standards Publication
P. Juul	HYTEK	PCB Reliability 2014 Publication
T. Sugimura, S. Sano T. Tamura	Yamanashi Avionics Co. Ltd. Japan Aerospace Exploration Agency	Current State and Future Trends of PCBs in AVIO Publication

Session 2: Packaging Technology Development

Presentor	Organisation	Title
S. Popelar	Aeroflex, Colorado Springs	Qualificaton of Class Y Flip Chip CGA Package Technology for Space Publication
J. Castaldo	Aeroflex Micoelectronics Solutions HiRel	Qualification of Class L Chip on Board Package Technology for Space Publication
W. Aklamavo	HCM.Systrel	HCM.Systrel Itar Free Columns Attach Publication
A. Rautiainen, E. Osterlund, H. Xu, V. Vuorinen, M. Paulasto-Krockel	Aalto University	Mechanical Characterization of SLID Bonded Au-Sn and Cu-Sn Interconnections for MEMS Packaging Publication
J. Bonnaud	ESA	Limitations of Standard Analysis and Verification Methods on Non-Hermetic Flip-Chip Components Publication

Wednesday 21 May 2014

Session 3: SMT Reliability

Presentor

Organisation

Title

W. Wickman, K. Clayton, C. Hunt

B. Dunn

National Physical Laboratory

ESA

Sn Whiskers and their Mitigation for Space, Aerospace

and Defence Electronics

Publication

E. Zaia, C. Andre, B. Moreau, D. Trias

Serma Technologies

Comparison between SnPb/SAC305 Solders: Structure

and Intermetallics Morphologies after Thermal Stress

Publication

A. Chaillot

N. Venet

P-E Tegehall

J. Hokka

Airbus Defense and Group

Thales Alenia Space

Swerea IVF

ESA

ENEPIG finish: An Alternative Solution for Space Printed

Circuit Boards (PCB)

Publication

G. Corocher

ESA

ESA Approach to Project Limited Verification

Publication

Session 4: Bonding Reliability

Presentor	Organisation	Title
A. Poenninger, T. Uhrmann, E. Pabo, T. Matthias	EV Group	Wafer Level Packaging - Processes and Manufacturing Equipment Publication
K. Huey	Xilinx	Xilinx Space Grade Packaging Development Updates Publication
L. Murphy	ESA	Challanges for Non-Hermetic Packaging Publication

Session 5: PCB Evaluation and Testing

Presentor	Organisation	Title
S. Heltzel	ESA	Cleaniness Control for PCBs Publication
B. Birch, J. Furlong A. Lewis	PWB Interconnect Solutions Inc. Airbus Defence and Space	Investigation into the cause and effect of tin lead diffusion into copper plated through hole barrels during accelerated high temperature testing Publication
B. Birch	PWB Interconnect Solutions Inc.	Establishing Effective Accelerated Testing Conditions and Criteria for Confirming Reliability for High Density Interconnect Circuits Publication
L. Pagnani	Cistelaier spa	A Conscious and "Risk Less" Approach to Complex PCB for Avionic and Space Application Publication
H. Swarbrick	INVOTEC Circuits	The Drive towards Zero Contamination Within the Delivered PCB Publication

Session 6: Emerging Technologies

Presentor	Organisation	Title
J. Hokka	ESA	An Overview of Recent SMT R&D Activities and a Look into Future Technologies Publication
N. Chilton	Printed Electronics Limited	Printed Electronic Interconnection Technologies Publication
L. Soli, L. Sollecchia, E. Picchione, U. Di Marcantonio B. Dunn	Thales Alenia Space S.p.A ESA	Electron Beam Brazing Reflow Technique Publication
M. Cauwe, F. Bossuyt, J. De Baets, J. Vanfleteren	IMEC/Ghent University	Flexible and Stretchable Circuit Technologies for Space Applications Publications

Thursday 22 May 2014

Session 7: RF and High-Power PCBs

Presentor	Organisation	Title
A. Fina, D. Nevo, P. Monfraix, N. Venet	Thales Alenia Space	Evaluation of the Manufacture of Mixed RF Boards Publication
M. Jonek	Tesat-Spacecom GmbH & Co.KG	PI-or HTgFr4-Material for High Power and High Voltage PCBs? Publication
M. Salter, N. Ridler, T. Loh, M. Harper, D. Hindley R. Green, P. Phelps, M. Walker	National Physical Laboratory EADS Astrium	Impact of Meshed Ground Planes on the Electromagnetic Behaviour of Printed Circuit Boards (PCBs) Publication

Session 8: SMT Assembly Verification

Presentor	Organisation	Title
G. Corocher	ESA	Assembly verification per ECSS-ST-Q-70-38C Publication
A, Mack, L. Scheele	Astrium GmbH Space Transporation	Experience with Vapour Phase Vacuum Soldering and Coating Publication
E. Simler	Matra Electronique	Assembly of CCGA and MCGA Components Publication
F. PerezGarcia B. Braux	Airbus Defence and Space CRISA Airbus Defence and Space France	SMT Qualifcation: Standards, Approvals and Surveillance Publication

Session 9: Packaging & Reliability Challenges

Presentor	Organsiation	Title
J. Noiray, P. Couderc, A. Val	3D PLUS	Stacking of Known Good Rebuilt Wafers for High Speed Memory and SiPs Publication
B. Vandevelde, R. Labie, L. Degrendele, M. Cauwe, J. De Baets, G. Willems	IMEC	Reduced 2nd Level Solder Joint Life Time of Low-CTE Mold Compound Package Interconnections Publication
O. Vendier, B. Bonnet, L. Raynaud, L. Mesthe, B. Espana D. Névo, J-F Villemazet S. Dareys, F. Courtade	Thales Alenia Space Thales Alenia Space CNES	New Materials for Next Generation of Microwave Packaging Publication

EMPPS Workshop

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