Document Properties | |
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Feedback to: | Holly Krijgsman |
Published: | 29-07-2014 |
Public Document |
EMPPS Workshop
Presentor | Organisation | Title |
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Mikko Nikulainen | ESA | Welcome and Introduction |
Session 1: PCB Standards and Roadmaps
Presentor | Organisation | Title |
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M. Brandon, D. Manteigas,
W. Scheidler |
MBDA EDA |
PCB Roadmap & Recommendations towards a European non-dependent & Sustainable PCB Supply Chain Publication |
B. Birch, J. Furlong | PWB Interconnect Solutions Inc. |
Plated Through Reliability and Material Integrity Results for 24 Materials |
L. Wallin | IPC Europe |
Increased Reliability and Quality with the Assistance by IPC Standards |
P. Juul | HYTEK | |
T. Sugimura, S. Sano T. Tamura |
Yamanashi Avionics Co. Ltd. Japan Aerospace Exploration Agency |
Session 2: Packaging Technology Development
Presentor | Organisation | Title |
S. Popelar | Aeroflex, Colorado Springs |
Qualificaton of Class Y Flip Chip CGA Package Technology for Space |
J. Castaldo | Aeroflex Micoelectronics Solutions HiRel |
Qualification of Class L Chip on Board Package Technology for Space Publication |
W. Aklamavo | HCM.Systrel |
HCM.Systrel Itar Free Columns Attach Publication |
A. Rautiainen, E. Osterlund, H. Xu, V. Vuorinen, M. Paulasto-Krockel | Aalto University |
Mechanical Characterization of SLID Bonded Au-Sn and Cu-Sn Interconnections for MEMS Packaging Publication |
J. Bonnaud | ESA |
Limitations of Standard Analysis and Verification Methods on Non-Hermetic Flip-Chip Components Publication |
Wednesday 21 May 2014
Session 3: SMT Reliability
Presentor | Organisation | Title |
W. Wickman, K. Clayton, C. Hunt B. Dunn |
National Physical Laboratory ESA |
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E. Zaia, C. Andre, B. Moreau, D. Trias | Serma Technologies |
Comparison between SnPb/SAC305 Solders: Structure |
A. Chaillot N. Venet P-E Tegehall J. Hokka |
Airbus Defense and Group Thales Alenia Space Swerea IVF ESA |
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G. Corocher | ESA |
ESA Approach to Project Limited Verification Publication |
Session 4: Bonding Reliability
Presentor | Organisation | Title |
A. Poenninger, T. Uhrmann, E. Pabo, T. Matthias |
EV Group |
Wafer Level Packaging - Processes and Manufacturing Equipment |
K. Huey | Xilinx |
Xilinx Space Grade Packaging Development Updates |
L. Murphy | ESA |
Challanges for Non-Hermetic Packaging Publication |
Session 5: PCB Evaluation and Testing
Presentor | Organisation | Title |
S. Heltzel | ESA | |
B. Birch, J. Furlong A. Lewis |
PWB Interconnect Solutions Inc. Airbus Defence and Space |
Investigation into the cause and effect of tin lead diffusion into copper plated through hole barrels during accelerated high temperature testing Publication |
B. Birch | PWB Interconnect Solutions Inc. |
Establishing Effective Accelerated Testing Conditions and Criteria for Confirming Reliability for High Density Interconnect Circuits |
L. Pagnani | Cistelaier spa |
A Conscious and "Risk Less" Approach to Complex PCB for Avionic Publication |
H. Swarbrick | INVOTEC Circuits |
The Drive towards Zero Contamination Within the Delivered PCB Publication |
Session 6: Emerging Technologies
Presentor | Organisation | Title |
J. Hokka | ESA |
An Overview of Recent SMT R&D Activities and a Look into Publication |
N. Chilton | Printed Electronics Limited |
Printed Electronic Interconnection Technologies Publication |
L. Soli, L. Sollecchia, E. Picchione, U. Di Marcantonio B. Dunn |
Thales Alenia Space S.p.A ESA |
Electron Beam Brazing Reflow Technique Publication |
M. Cauwe, F. Bossuyt, J. De Baets, J. Vanfleteren
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IMEC/Ghent University |
Thursday 22 May 2014
Session 7: RF and High-Power PCBs
Presentor | Organisation | Title |
A. Fina, D. Nevo, P. Monfraix, N. Venet | Thales Alenia Space | |
M. Jonek | Tesat-Spacecom GmbH & Co.KG |
PI-or HTgFr4-Material for High Power and High Voltage PCBs? |
M. Salter, N. Ridler, T. Loh, M. Harper, D. Hindley R. Green, P. Phelps, M. Walker |
National Physical Laboratory EADS Astrium |
Impact of Meshed Ground Planes on the Electromagnetic Behaviour |
Session 8: SMT Assembly Verification
Presentor | Organisation | Title |
G. Corocher | ESA |
Assembly verification per ECSS-ST-Q-70-38C Publication |
A, Mack, L. Scheele | Astrium GmbH Space Transporation |
Experience with Vapour Phase Vacuum Soldering and Coating Publication |
E. Simler | Matra Electronique |
Assembly of CCGA and MCGA Components Publication |
F. PerezGarcia B. Braux |
Airbus Defence and Space CRISA Airbus Defence and Space France |
SMT Qualifcation: Standards, Approvals and Surveillance |
Session 9: Packaging & Reliability Challenges
Presentor | Organsiation | Title |
J. Noiray, P. Couderc, A. Val | 3D PLUS |
Stacking of Known Good Rebuilt Wafers for High Speed
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B. Vandevelde, R. Labie, L. Degrendele, M. Cauwe, J. De Baets, G. Willems |
IMEC |
Reduced 2nd Level Solder Joint Life Time of Low-CTE |
O. Vendier, B. Bonnet, L. Raynaud, L. Mesthe, B. Espana D. Névo, J-F Villemazet S. Dareys, F. Courtade |
Thales Alenia Space Thales Alenia Space CNES |
New Materials for Next Generation of Microwave Packaging Publication |